电路板孔的可焊性影响焊接质量
The solderability of circuit board holes affects the welding quality
电路板孔可焊性不好，将会产生虚焊缺陷，影响电路中元件的参数，导致多层板元器件和内层线导通不稳定，引起整个电路功能失效。所谓可焊性就是金属表面被熔融焊料润湿的性质，即焊料所在金属表面形成一层相对均匀的连续的光滑的附着薄膜。
Poor solderability of circuit board holes will produce false soldering defects, affect the parameters of components in the circuit, lead to unstable conduction of multilayer board components and inner wires, and cause the function failure of the whole circuit. The so-called solderability is the property that the metal surface is wetted by molten solder, that is, a relatively uniform continuous and smooth adhesion film is formed on the metal surface where the solder is located.
影响印刷电路板可焊性的因素主要有：（1）焊料的成分和被焊料的性质。焊料是焊接化学处理过程中重要的组成部分，它由含有助焊剂的化学型线  流水槽模具 景观石 检查井钢模具 保定通风管道 隔离墩模具 保定保洁公司材料组成，常用的低熔点共熔金属为Sn-Pb或Sn-Pb-Ag，其中杂质含量要有一定的分比控制，以防杂质产生的氧化物被助焊剂溶解。焊剂的功能是通过传递热量，去除锈蚀来帮助焊料润湿被焊板电路表面。一般采用白松香和异丙醇溶剂。
The main factors affecting the solderability of printed circuit board are: (1) the composition of solder and the properties of solder. Solder is an important part in the process of welding chemical treatment. It is composed of chemical materials containing flux. The commonly used low melting point eutectic metal is Sn Pb or Sn Pb AG. The impurity content should be controlled in a certain proportion to prevent the oxide produced by impurities from being dissolved by flux. The function of flux is to help solder wet the circuit surface of the soldered board by transferring heat and removing rust. White rosin and isopropanol solvent are generally used.