印制板从单层发展到双面、多层和柔性，并且仍旧保持着各自的发展趋势。由于不断地向高精度、高密度和高可靠性方向发展，不断缩小体积、减少成本、提高性能，使得印制板在未来电子设备的发展工程中，仍然保持着强大的生命力。
Printed boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their respective development trends. Due to the continuous development in the direction of high precision, high density and high reliability, reducing the volume, reducing the cost and improving the performance, the printed board still maintains strong vitality in the development project of electronic equipment in the future.
综述国内外对未来印制板生产制造技术发展动向的论述基本是一致的，即向高密度，高精度，细孔径，细导线，细间距，高可靠，多层化，高速传输型线  流水槽模具 景观石 检查井钢模具 保定通风管道 隔离墩模具 保定保洁公司，轻量，薄型方向发展，在生产上同时向提高生产率，降低成本，减少污染，适应多品种、小批量生产方向发展。印制电路的技术发展水平，一般以印制板上的线宽，孔径，板厚/孔径比值为代表。
The discussion on the development trend of future printed board production and manufacturing technology at home and abroad is basically the same, that is, to develop in the direction of high density, high precision, fine aperture, fine wire, fine spacing, high reliability, multilayer, high-speed transmission, light weight and thin, to improve productivity, reduce cost, reduce pollution and adapt to multi variety and small batch production. The technical development level of printed circuit is generally represented by the line width, aperture and plate thickness / aperture ratio on the printed board.